Huawei, Intel step up engineering links

Huawei, a leading global information and communications technology (ICT) solutions provider, has signed a memorandum of understanding (MoU) with Intel Corporation signaling the will of both companies to strategically cooperate in enhancing joint engineering efforts and bringing new IT solutions to the market.
Announced during the Huawei Cloud Congress 2012, the collaboration will include enhancing engineering cooperation and building competitive products & solutions for server, storage, data center and cloud computing-as well as jointly going to market in China and other geographic areas.
The combined advantages of both Intel and Huawei promises to bring significant value to customers in various industries by delivering compelling information technology that provide customers with new user experiences that can produce business return.
The aim of the MoU is also geared at sharing market development efforts, synchronizing future strategies and shortening product development cycles.
This will be done through improving solution alignment and joint innovation so that the time to deliver the right solution to customers can be shortened.
“Intel leads in computing innovation, and builds advanced platforms for server, cloud computing, storage and data center solutions,” said Ian Yang, Intel corporate vice president and China president.
“The strategic MoU between Intel and Huawei will bring the cooperation to a new level. The key advantage for both companies is the ability to bring new innovative product and usage models to market.”
Zheng Yelai, president of Huawei IT product line, said: “Huawei has strong capability in server, storage, data center and cloud computing. We have had an excellent collaboration over the past 10 years with Intel. The strategic global cooperation MoU on IT will only help to strengthen the Huawei and Intel relationship, and allow us both to innovate around customer demand — providing more efficient, more valuable ICT solutions to our customers.”